In real OEM projects, pressure measurement problems are often caused by selecting the wrong integration level, not by the sensing chip itself. “Sensor”, “transducer”, and “transmitter” are frequently mixed in RFQs, but they imply different engineering responsibilities: signal conditioning, temperature compensation, enclosure/IP, EMC robustness, and field wiring.

This article explains the practical differences and shows how to match requirements to Winsen models using our updated pressure product list.


1) The industry problems that make selection fail

Problem A: “Works on the bench, fails in the field”

Typical root causes are long cable runs, EMI/ground issues, moisture ingress, and temperature cycling. If your system connects to PLC/remote wiring, a raw element is usually not enough—choose a conditioned module or a field-ready transmitter.

Problem B: Corrosion, dirty media, clogging

When media is corrosive or contains particles, you typically need an isolation structure (oil-filled isolation film or flush diaphragm) to protect the sensing element and reduce drift/hysteresis growth.

Problem C: Integration speed vs BOM optimization

OEMs either:

  1. integrate a core sensor (lowest BOM, but you own analog & calibration), or
  2. choose a module/transmitter (faster integration, higher consistency in production).

2) Clear definitions

2.1 Pressure Sensor

A sensor tekanan typically refers to the pressure-sensitive element (or core assembly) that converts pressure into an electrical signal—often mV/V bridge output or low-level analog that requires your own amplification and compensation strategy.

Best when

  • You own the electronics and calibration
  • You need custom mechanical packaging or tight BOM control

Winsen examples (sensor/core level)

  • WPAH01 Ceramic Pressure Sensor (core) – piezoresistive ceramic sensitive film, laser calibration for zero/full scale, Ø18×6.35 mm, 2–400 bar, -40 to 125°C, ceramic diaphragm.
  • WPAH31 Ceramic Pressure Sensor (core) – ceramic diaphragm with laser trimming, ranges including 2/5/10/20/40/50/100 bar (optional); typical sensitivity and stability specs listed, and 2× rated overload described.
  • WPAK63 Isolation-Film Pressure Sensor (core) – 316L diaphragm/housing, silicone oil fill, shock/vibration and lifecycle indices listed (oil-filled isolation structure).
  • WPAS01 Plastic Package Pressure Sensor (core) – MEMS, SOP8, ≤1 ms response, wide pressure range listed up to 1.7 MPa, -40 to 125°C, typical output parameters in mV.
  • WPAS02 Plastic Package Pressure Sensor (core) – MEMS, SOP6, ≤1 ms response, pressure ranges listed from vacuum/low kPa up to 200 kPa, -40 to 125°C.
WPAH31 Ceramic Pressure Sensor
WPAH31 Ceramic Pressure Sensor
WPAH01 Ceramic Pressure Sensor
WPAH01 Ceramic Pressure Sensor
WPAK63T General Type Isolation-Film Pressure Sensor
WPAK63T General Type Isolation-Film Pressure Sensor
WPAK63J General Type Isolation-Film Pressure Sensor
WPAK63J General Type Isolation-Film Pressure Sensor
WPAK63 General Type Isolation-Film Pressure Sensor
WPAK63 General Type Isolation-Film Pressure Sensor
Sensor Tekanan Paket Plastik WPAS08
Sensor Tekanan Paket Plastik WPAS08
WPAS01 Plastic Package Pressure Sensor
WPAS01 Plastic Package Pressure Sensor
WPAS02 Plastic Package Pressure Sensor
WPAS02 Plastic Package Pressure Sensor

2.2 Pressure Transducer (packaged conversion device for OEM integration)

In many OEM specifications, “pressure transducer” usually means a packaged device that outputs a more usable signal than a raw bridge—often standard voltage output—to reduce your analog workload.

Best when

  • You want faster integration into an MCU/ADC system without building a full analog chain from mV/V

Winsen example (module/transducer level)

  • WPBH01 Ceramic Pressure Sensor Module – Ø18×11.8 mm, range 2–400 bar, 5 V supply, output 00,5–4,5V (standard), multiple accuracy grades, compensation temperature options listed.
WPBH01 Ceramic pressure sensor module
WPBH01 Ceramic pressure sensor module

2.3 Pressure Transmitter (field-ready instrumentation level)

A pemancar tekanan is a complete device that includes amplification + temperature compensation + industrial packaging, and provides standardized outputs suitable for real equipment wiring (e.g., 4–20mA, voltage, or digital bus).

Best when

  • You connect to PLC/DCS/SCADA or long cable runs
  • You need consistent output across environment and production

Winsen examples (pressure transmitters)

  • WPCH01 Ceramic Pressure Transmitter – output signal listed as Current / Voltage / I²C (customizable), multiple connections, IP67, overload and stability targets listed.
  • WPCH04 Ceramic Pressure Transmitter – detection range listed up to 40 MPa, output 4–20 mA / 0–5 V / 0.5–4.5 V (customizable), multiple mechanical connections, fast response, anti-interference and consistency features listed.
  • WPCK03 Diffused Silicon Pressure Transmitter (digital) – output saya²C, pressure references Gauge / Absolute / Segited Gauge, wide pressure range listed up to 100 MPa, low current, 316L housing/diaphragm listed.
  • WPCK07 Diffused Silicon Pressure Transmitter (RS485) – described as using a microprocessor-centered circuit and providing RS485 communication output for digital debugging and calibration.
  • WPCK89 Digital Output Pressure Transmitter – described with IIC bus up to 400K, 50 samples/sec collection rate, low power and strong anti-interference, multi-level protection.
WPCH03 Pressure Transmitter
WPCH03 Pressure Transmitter
WPCH04 General Type Ceramic Pressure Transmitter
WPCH04 General Type Ceramic Pressure Transmitter
WPCH01 General Type Ceramic Pressure Transmitter
WPCH01 General Type Ceramic Pressure Transmitter
WPCK07 Diffussed Silicon Pressure Transmitter Digital Display Version
WPCK07 Diffussed Silicon Pressure Transmitter Digital Display Version
WPCK04 Pemancar Tekanan Silikon Tersebar
WPCK04 Pemancar Tekanan Silikon Tersebar
WPCK08 Level Transmitter
WPCK08 Level Transmitter
WPCK05 Diffused Silicon Pressure Transmitter
WPCK05 Diffused Silicon Pressure Transmitter
WPCK07 Pemancar Tekanan Silikon Tersebar
WPCK07 Pemancar Tekanan Silikon Tersebar
WPCK03 Diffused Silicon Pressure Transmitter
WPCK03 Diffused Silicon Pressure Transmitter

3) Winsen “integration ladder” (fast selection logic)

Choose the integration level first—then pick technology and structure:

  1. Core sensor (mV/V or low-level) → best for OEMs with their own analog + calibration

    • WPAH01 / WPAH31 / WPAK63 / WPAS01 / WPAS02
  2. Module / transducer (voltage output module) → fastest MCU integration

    • WPBH01 (0.5–4.5 V)
  3. Transmitter (industrial wiring + compensation + IP) → best for field applications

    • WPCH01 / WPCH04 / WPCK03 / WPCK07 / WPCK89

4) Requirement checklist (copy/paste for OEM RFQ)

4.1 Pressure definition (avoid the #1 mistake)

  • Pressure reference: Gauge / Absolute / Differential / Sealed Gauge (PSIS)
  • Working range + peaks (proof/burst expectation)
  • Response time requirement (control loop vs monitoring)

Realted Read: Tekanan Absolut vs. Tekanan Pengukur vs. Tekanan Diferensial

4.2 Output & system architecture

  • mV/V core vs voltage module vs 4–20 mA / voltage / I²C / RS485 transmitter
  • Supply voltage, cable length, EMC environment

4.3 Media + mechanical interface

  • Dry gas vs liquid; corrosive vs non-corrosive
  • Need isolation film / flush diaphragm?
  • Connection: G, NPT, M20×1.5, etc. (WPCH series lists multiple options)

4.4 Accuracy model

  • %FS / %reading, compensated temperature range
  • Hysteresis/repeatability, long-term drift

5) Product matching by application (Winsen recommendations)

A) Micro differential pressure (HVAC filters, airflow, cleanroom)

  • WPAS13 Digital Micro Differential Pressure Sensor – operating pressure range -500 to +500 Pa, 1.8–3.6 V supply, 20-bit resolution, low operating current listed (at 1 Hz).

B) Harsh / corrosive media and long-term stability

  • Ceramic core approach: WPAH01 / WPAH31 (ceramic diaphragm, overload and corrosion resistance described)
  • Isolation-film approach (media isolation needed): Wpak63 (316L + silicone oil fill)

C) Process interface requiring flush diaphragm structure

  • WPAK77 Flush Diaphragm Pressure Sensor with Clamp – detection range listed 0–10 kPa … 6 MPa.

D) Pumps / compressors / smart water / general industrial pressure control

  • Field-ready ceramic transmitter: WPCH01 (Current/Voltage/I²C, IP67, stability and overload targets listed)
  • Higher range + multiple standard outputs: WPCH04 (4–20 mA / 0–5 V / 0.5–4.5 V)

E) Digital OEM systems (bus interface + anti-interference)

  • WPCK03 (I²C + gauge/absolute/sealed gauge)
  • Wpck89 (IIC bus 400K, 50 samples/sec, low power, anti-interference)
  • Wpck07 (RS485 output for digital debugging/calibration)

F) Cost-sensitive OEM / compact integration

  • WPAS12 – integrated analog output; voltage output proportional to supply; analog output range 0.18–4.65 V over 15–115 kPa absolute described.
  • WPAS01 / WPAS02 – plastic package MEMS cores for module assembly (mV-level output parameters listed).

7) Quick FAQ

Is a pressure transducer the same as a pressure transmitter?

In the market, “transducer” is often used loosely. For engineering selection, a transmitter is usually the field-ready device with standardized outputs and enclosure protection, while a module/transducer is often a mid-level integration step (e.g., voltage module without a transmitter shell).

When should I choose 4–20 mA?

Choose 4–20 mA when you need robust industrial wiring, longer cable runs, and stronger noise immunity (WPCH04 lists 4–20 mA as an output option).

When should I choose sealed gauge (PSIS)?

When your reference environment is sealed (not vented to current atmosphere), specify sealed gauge to avoid reference errors. WPCK03 lists Gauge / Absolute / Segited Gauge references.

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